Micron Laser Technology presents PCB Depanelizer and part excising solutions for customer products, original equipment manufacturers, and printed circuit board manufacturers. MLT’s numerous laser machining centers are equipped to handle volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a combination of both.
Depending on the material and the part requirements, MLT provides a tool-less part removal process by means of final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, without any cutting oils or some other contaminants.
Hold-in tabs are small uncut sections regarding the part utilized to secure the part in the panel. The hold-in tabs are used for easy of handling small parts or part securement for extra processing. The hold-in tab width is chosen based on the level of force desired to removed the part from your panel/sheet or known forces to get applied by downstream processes like component loading or electro-polish. MLT can make tabs in many any material and also to any width and site about the part.
Laser scoring produces a limited depth ablation line within the part or material set. The depth is usually 50% of the material thickness but can be controlled to your desired depth. The scoring acts similar to the hold-tab to secure the part inside the panel or sheet, but provides for individual parts to become ‘snapped’ out. Laser scoring lines can also be used as a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into condition without expensive forming dies.
Much like scoring or v-grooves, laser perforations are another choice for tool-less part removal from a panel or sheet. Perforations can be laser formed for any size and spacing to meet the preferred removal and Pneumatic PCB Depanelizer. Depending on the material as well as the part requirements, BEST laser services provides a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. Utilizing a laser to do the depaneling gives the user the main benefit of speed and positional accuracy. Unlike mechanical methods there is absolutely no part induced stresses, no tooling cost with no cutting oils or any other contaminants.
Laser depaneling is great for rigid-flex boards as it possesses a precise way to cut through a number of materials including although not restricted to these most frequent materials seen:
Combinations thereof, suitable for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST can be that provider of laser depanelization if you have lots of IoT devices which lmuteg to become precisely machined or cut out to match perfectly in to small mechanical enclosures.
Due to the contact-free processing that goes on with laser depanelization of printed circuit boards, there is very little distortion even if thin materials are employed. When boards are milled or punched out using a mechanical tool there could prove to be a loss precision and potentially a distortion within the outside board dimensions. Even worse it may crack solder joints when utilizing these mechanical means. In BEST laser depanelization system feature fiducial registration and online scaling, which suggests already existing distortions can be compensated and also the cut contours positioned precisely inside the layout.
The techniques for straight line Laser PCB Depaneling, that are set up for rectangular-shaped PCBs, all cut or crush the advantage in the board edge. These methods include die cutting, punching or V-scoring the assembly or by using a wheel cutter or a saw. The sawing method typically works with a single rotating blade spinning at high RPM to reduce the panel to the shapes required. This technique produces heat in the reduce area as
well as creating debris being a byproduct of the cutting operation. In V-scoring the depth from the thickness of the board is 30-40% of the original board thickness since it is cut from either side of the board. After assembly the board is broken at this particular v-score line. Alternately a “pizza cutter” cuts with the V-score from the panel and cuts the remaining web till the boards are in their final cutout shape thereby putting strain on the components and solder joints-particularly those nearby the board edge. In another method, the singulated board outline may be punched out constitute the panel. This requires that a new punch be utilized for every single kind of circuit board which suggests it is really not a flexible method of board cut out. The punch force can also bend or deform the edges of the PCB.